Diamond Grinding Segments

1. High efficiency and long lifespan
2. Competitive price and stable quality
3. Production capacity: 90,000 sets/month
4. Various segment sizes and shapes available
5. Good cutting result: smooth cutting, flat surface and even size

Diamond Grinding Segments

Experienced manufacturer of Diamond Grinding Segments, we supply diamond segments, diamond saw blades, diamond wire saw and diamond grinding tools for stone factories, quarries and wholesalers all over the world.


For 300mm-3500mm saw blades, diamond frame gang saw blades, diamond core drill bits, diamond grinding cup wheels and different machines (multi blade cutter, gang saw blade, bridge cutting machine, single arm cutting machine, manual handing machine, able cutting machine, etc.) Diamond segment types include sandwich segment, multi-layer segment and orderly arrayed segment and carbide tips, every type is designed for various hardness stone (soft, medium hard and very hard stones) cutting: granite, marble, sandstone, onyx, limestone, travertine, quartz stone, artificial stone, andesite, volcanic, lava stone, basalt, microcrystal stone, blue stone, dolomite and construction materials (concrete, tile, ceramic, asphalt, floor) to reduce segment cost and increase cutting efficiency.

Packaging and Shipping

One set of diamond segments packed in 1 box, 10 boxes in a carton and then cartons packed in crate. Besides the diamond segments could also be packed according to your specific request.
Rust proofed before packing - Water proofed - Impact protection.
Urgent order with less weight or samples, courier service is recommended;
Normal (regular) order which weight over 45kgs, delivering by air is recommended;
Big diameter saw blades or heavy weight products, shipping by sea is recommended.
Edgestone will offer advices according to the actual order requirements.

Our Services

1. Fine raw materials are used for processing, high grade raw materials, imported cobalt powder and high-quality diamond single crystals, to ensure the best performance of our products.
2. Customized designs are available. We can also help customers design and develop new products, and adjust cutting efficiency and lifespan upon your request.
3. Knowledgeable sales representatives are available to reply all inquiries and e-mails within 24 hours.
4. Every details will be confirmed with you before production.
5. Each processing would be completed by our skillful worker.
6. Strict quality management system. During the whole production process, from raw material choosing, processing to packing, our quality assurance people will strictly control each single and every process to guarantee quality standards and punctual delivery.
7. Detailed and clear pictures will be sent before packing and loading for you.
8. We will keep you update of the order and shipping status till you get the products smoothly.

If you're interested in Diamond Grinding Segments, just feel free to contact us, we will keep providing excellent service and good quality products for you.

Contact Info.

Sales Manager: Adam Li
Phone/WhatsApp: 0086-15805032000
Skype: adam-li@outlook.com

the cooling water flow is small and the beads are overheated: the diamond rope slides on the drive wheel due to overheating: the diamond rope is suddenly caught. The main way to solve the above problems is to reduce the feed pressure: multi-nozzle increase  Add cooling water flow: Use a chess piece to clamp the diamond rope saw seam to avoid excessive friction. The large diamond rope is clamped. 4. Diamond rope cannot be cut The diamond particles in the beads are worn out or worn out, so that the beads cannot be cut normally. The reason for this status is that there are a lot of hard minerals in the stone when cutting stone: the contact length between the diamond rope and the stone is relatively large: the speed of the diamond rope is large, and when the concrete is cut, there is a steel with high strength inside.  Ribs. To solve the above problems, the following methods can be adopted: sharpening diamond beads on the wear-resistant material; reducing the feeding speed of the diamond rope: adjusting the guide wheel to reduce the contact length between the diamond rope and the stone. Section V Diamond Wire Saw   First, diamond wire saw application  Diamond wire saws are a hard and brittle material cutting process that has been rapidly developed in recent years. The process of cutting brittle semiconductor materials with diamond wire saws was first proposed by Mech in the 1970s. W. Ebner conducted an early wire saw machining experiment with a driving wheel drum and a follower  The reciprocating test machine composed of pulleys, the two ends of the diamond wire are fixed around the radial ends of the drum respectively. The motor-driven wheel drum drives the wire to reciprocate. W Ehner used this to cut p to obtain a slice thickness of less than 0.4 mm. In the 1980s, there was a  Cutting a diamond multi-wire saw on a silicon wafer. Anderson J. R. Using a YQ-100 diamond multi-wire saw from Japan Yasunagar Corp. to perform a silicon sectioning experiment, the resulting kerf width Less than 0.16mrn, the depth of the surface damage layer is less than 5μ., n1o entered the 1990s? Especially in recent years, diamond wire The saw has developed rapidly. Diamond wire saw uses high-hardness diamond as abrasive, its typical abrasive grain size is several tens of micrometers, and it also has the characteristics of wire saw cutting. It can perform precision and narrow saw cutting on hard and brittle materials, and can be shaped and processed. With the application of large-size semiconductor and photocell sheet cutting  With and development, diamond wire saws have gradually emerged a series of unparalleled advantages: the surface damage is small, the deflection is small, the slice thickness and thickness consistency are good, and large-size silicon chains can be cut, saving materials and high efficiency. Large output, high efficiency. The main applications of diamond wire saw include the following. C l ) Solar field: monocrystalline silicon rod or polysilicon silicon etched; silicon wafer slicing.  Diamond Grinding Segments  (2) LED field: sapphire crystal rod cutting and slicing. (3) Other fields: Magnetic materials such as magnets or ferrite magnets: Silicon carbide and other hard-to-cut materials, various substrates: crystal chips, ceramic cutting. Second, diamond wire saw classification  Diamond wire saws are classified into two types, free abrasives and national abrasives. Currently, in the cutting of hard and brittle materials such as silicon crystals, the main technique of free-abrasive wire saw cutting is to cut the edge while sending the grout with abrasive to the wire. However, there are obvious disadvantages to the free abrasive wire sawing and cutting technology: cutting efficiency  The rate is low, saw cut loss is large, surface roughness and surface accuracy are difficult to control, slurry recovery is difficult, and the working environment is harsh. In order to solve the above problems, the research on the fixed abrasive wire saw has been increasingly accepted by scholars both at home and abroad.