Diamond Polishing Pads Set

1 High efficiency and long lifespan
2 Competitive price and stable quality
3 Production capacity: 60,000 pieces/month
4 Various polishing pad sizes, grits and types available
5 component: resin and diamond
6 Adapter: hook and loop

Diamond Polishing Pads Set

Experienced manufacturer of Diamond Polishing Pads Set, we supply diamond segments, diamond saw blades, diamond wire saw and diamond grinding tools for stone factories, quarries and wholesalers all over the world.


Dry and wet use, diamond polishing pads are backed with Velcro, can be mounted on a rigid backer pad to fit on angle grinder, floor polishing machine, other hand hold machine to polish, maintain, or restore for granite ,marble, sandstone, onyx, limestone, travertine, quartz stone, artificial stone, andesite, volcanic, lava stone, basalt, microcrystal stone, blue stone, dolomite and construction materials (concrete, tile, ceramic, asphalt, floor) to reduce cost and increase polishing efficiency.

Packaging and Shipping for Diamond Polishing Pad

The inner packaging is carton, outside packaging is according to the transport way, if by air, we recommend carton package which will reduce the weight; if by sea, we recommend crate which is seaworthy. Other packaging is also available upon your request.
Urgent order with less weight or samples, courier service is recommended;
Normal (regular) order which weight over 45kgs, delivering by air is recommended;
Big diameter saw blades or heavy weight products, shipping by sea is recommended.
Edgestone will offer advices according to the actual order requirements.

Our Services

1. Fine raw materials are used for processing, high grade raw materials, imported cobalt powder and high-quality diamond single crystals, to ensure the best performance of our products.
2. Customized designs are available. We can also help customers design and develop new products, and adjust cutting efficiency and lifespan upon your request.
3. Knowledgeable sales representatives are available to reply all inquiries and e-mails within 24 hours.
4. Every details will be confirmed with you before production.
5. Each processing would be completed by our skillful worker.
6. Strict quality management system. During the whole production process, from raw material choosing, processing to packing, our quality assurance people will strictly control each single and every process to guarantee quality standards and punctual delivery.
7. Detailed and clear pictures will be sent before packing and loading for you.
8. We will keep you update of the order and shipping status till you get the products smoothly.

If you're interested in Diamond Polishing Pads Set, just feel free to contact us, we will keep providing excellent service and good quality products for you.

Contact Info.

Sales Manager: Adam Li
Phone/WhatsApp: 0086-15805032000
Skype: adam-li@outlook.com

The computer simulating the sawing mechanism of the wire saw    Due to 4 - 10 diamond rope cut process Although the initial test results are quite optimistic, the numerical simulation has always lacked universality, and thus it has not yet become an ideal tool for bead composition and wire saw optimization design.   Section IV The theoretical model of coring  In the core drilling process, the drill bit rotates in the same direction with the outer diameter linear velocity of 1 lOm/s, and is in continuous and effective contact with the material being cut. The diamond tail of the drill bit is similar to the sawing process of the circular saw, forming a hopper-like matrix support, as shown in Fig. 4-11.    Figure 4-11 Coring drilling diagram  Figure 4-11 shows the movement conditions of chip formation during the core drilling process. Compared to the diamond sawing technology discussed earlier, this condition is relatively simple. Assume that the crown of the drill bit consists of a series of single, equally spaced blades with the same width as the coring cylinder and equal in height.    For a single diamond, the chip thickness h is a fixed value, as in formula (4 -7 ): h = h = two (4 -7) V LW The closed-loop configuration of the chip zone obstructs the evacuation of drill cuttings at the incision. In order to avoid excessive wear of the tool due to friction, a sufficient amount of coolant is required to flow through the center of the coring barrel to remove debris. Normally, water is used as a cooling medium and is pumped into a narrow channel between the coring tube and the drilling material for circulation. In order to ensure a good liquid flow cycle, the crown of the drill bit must have a segmented or quasi-continuous bead ring design with a special nozzle.  Section 5 Small knots  In actual situations, the cutting edges are not always fixed at the same height, but are randomly arranged. Therefore, only a small part of the diamond surface of the tool interacts with the workpiece. During the diamond crushing and cutting cycle, the height of the cutting edge and the several servo structure of the cutting edge gradually change. Therefore, the cutting process is usually affected by the following factors: (1) The instantaneous appearance of the machined surface. (2) Workpiece properties (mineral composition, strength, hardness, particle size, etc.). (3) The force between the tool and the workpiece. (4) Stress distribution within the workpiece. (5) The temperature and distribution of the entire cutting zone. (6) Some other system-related variables and sporadic events. The existing cutting the.ory of natural stone and ceramic materials distinguishes between the initial production process of the chips and the secondary forming process and considers: Chips are initially generated in the front of the diamond blade due to the tensile and compressive stresses that occur when the diamond moves across the surface of the workpiece. During the initial production of chips, the leading edge pits and the worm-like support are produced behind each cutting diamond, as shown in Fig. 4-12.    Figure 4-12 Cluster morphology under circular saw blade segments   Diamond Polishing Pads Set  At the same time, the compressive stress generated under the diamond blade deforms the workpiece material. When the load is removed, elastic recovery Complex will lead to the generation of critical tensile stress, causing brittle fracture, resulting in ___:_ secondary chipping behind the diamond. This th.eory has been well verified in reality. When the scratch test is performed on brittle ceramics, the material removal is Over-plastic rheology and brittle fissile formed by the chip to achieve. When the depth of diamond cutting is sufficient to cause cracks, chips are generated due to brittle fission of the material. The principle is shown in Figure 4-13. At the bottom of the trench created by the tangential movement of the abrasive material, there is an irreversible plastic deformation zone along the direction of wear, which includes two radial and horizontal crack systems. Radial cracks that cause brittle material strength to decrease? It is produced by "V" type abrasive particles under normal force.